Congatec COM Express conga-B915 Bedienungsanleitung PDF herunterladen (Seite 15)

Row C&D:

PCI Express Graphics

(PEG x16)

2x SDVO

(shared with PEG)

IDE

PCI 32 Bit

VCC

(+12V primary, +5V standby,

3,3V RTC)

Row A&B:

6x PCI Express

4x SATA

8x USB

2x ExpressCard

1x Ethernet 100/1000

AC’97/HDA

Flatpanel (2x24Bit LVDS)

VGA

TVout

I²C

LPC

SMB

8x GPIO

compact 95x95mm²

basic 125x95mm²

extended 155x110mm²

w w w.congatec.com

COM ExpressXTX / ETX

COM Express

™

- the concept

COM Express™ is a PICMG standard that defines a Computer-On-Module, or COM, packaged as a super com-

ponent. The defined interfaces provide a smooth transition path from legacy interfaces to LVDS (Low Voltage

Differential Signaling) serial interfaces. This includes SDVO, PCI Express and Serial ATA. COM Express™ defines

5 different pinout types in order to be scalable for future applications.

New interfaces

COM Express™ deﬁnes 440 interconnect pins

between the COM Express™ module and the

carrier board. Legacy buses such as PCI, parallel

ATA and LPC are supported along with new serial

high speed interfaces such as PCI Express, Serial

ATA and Gigabit Ethernet.

Legacy free

COM Express™ is a legacy free standard. Out-

dated interfaces such as ﬂoppy, PS/2 keyboard/

mouse, RS232, LPT are no longer supported. If re-

quired, these legacy interfaces can be optionally

generated on the customized carrier board.

Size

COM Express™ modules are available in three

different sizes: Compact, Basic and Extended.

The primary difference between the modules is

the overall physical size and the performance

envelope supported by each. The Extended

module is the biggest and can support more

power consuming processors and chips with

larger footprints.

Thermal Design

As with XTX™ and ETX

, the COM Express™

deﬁnition includes a heatspreader that acts as

a thermal interface between the COM Express™

module and the system‘s cooling solution. All

heat generating components are thermally

conducted to the heatspreader in order to avoid

hot spots.

PCI Express

In addition to the 32 bit parallel PCI bus, COM

Express™ offers up to 22 PCI Express™ lanes. This

allows the customer to equip their embedded

PC application with the next generation of PC

performance. PCI Express™ is a low pin count

interface with maximum bandwidth per pin. The

scalable bandwidth is 2.5 GBit/s per lane and

direction.

GPIO

COM Express™ deﬁnes freely usable general

purpose inputs and outputs.

PCI Express Graphic (PEG)

The PEG interface utilizes up to 16 PCI Express

lanes in order to drive an external ultra high

performance graphic controller located on the

carrier board.

ExpressCard™

COM Express™ supports ExpressCard™ slots.

ExpressCard™ is the successor to PCMCIA. This

interface allows the use of USB 2.0 and PCI

Express™ applications as well.

About PICMG

PICMG is a consortium of over 450 companies

who collaboratively develop open speciﬁcations

for high performance telecommunications and

industrial computing applications. The members

of the consortium have a long history of develop-

ing leading edge products for these industries.

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